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Electrical modeling of quad flat no-lead packages for high-..:
, In:
2004 IEEE Region 10 Conference TENCON 2004.
,
Yeong-Lin Lai
;
Cheng-Yu Ho
- p. 344,345,346,347 , 2004
Link:
https://doi.org/10.1109/TENCON.2004.1414940
RT T1 <cTitle>2004 IEEE Region 10 Conference TENCON 2004.</cTitle>: T1 <Title>Electrical modeling of quad flat no-lead packages for high-frequency IC applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-1414940&Exemplar=1&LAN=DE A1 Yeong-Lin Lai A1 Cheng-Yu Ho YR 2004 K1 Integrated circuit modeling K1 Integrated circuit packaging K1 Application specific integrated circuits K1 Insertion loss K1 Predictive models K1 Electromagnetic modeling K1 Numerical simulation K1 Parasitic capacitance K1 Scattering parameters K1 Numerical models SP 344,345,346,347 LK http://dx.doi.org/https://doi.org/10.1109/TENCON.2004.1414940 DO https://doi.org/10.1109/TENCON.2004.1414940 SF ELIB - SuUB Bremen
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