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1 Ergebnisse
1
Integration and reliability of a manufacturable 130nm dual ..:
, In:
Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.
,
Lee, T.J.
;
Lim, Y.K.
;
Zhang, F.
... - p. 489,490,491,492 , 2004
Link:
https://doi.org/10.1109/ICSICT.2004.1435054
RT T1 <cTitle>Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.</cTitle>: T1 <Title>Integration and reliability of a manufacturable 130nm dual damascene Cu/low-k process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-1435054&Exemplar=1&LAN=DE A1 Lee, T.J. A1 Lim, Y.K. A1 Zhang, F. A1 Tan, D. A1 Siew, Y.K. A1 Perera, C. A1 Bu, X.M. A1 Chong, D. A1 Vigar, D. A1 Sun, S.C. YR 2004 K1 Manufacturing processes K1 Copper K1 Lithography K1 Silicon carbide K1 Testing K1 Semiconductor device manufacture K1 Packaging K1 Dielectric materials K1 Utility programs K1 Silicon compounds SP 489,490,491,492 LK http://dx.doi.org/https://doi.org/10.1109/ICSICT.2004.1435054 DO https://doi.org/10.1109/ICSICT.2004.1435054 SF ELIB - SuUB Bremen
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