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1 Ergebnisse
1
Reactively sputtered vanadium nitride as diffusion barrier ..:
, In:
Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.
,
Xin-Ping Qu
;
Mi Zhou
;
Guo-Ping Ru
. - p. 520,521,522,523 , 2004
Link:
https://doi.org/10.1109/ICSICT.2004.1435060
RT T1 <cTitle>Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.</cTitle>: T1 <Title>Reactively sputtered vanadium nitride as diffusion barrier for copper interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-1435060&Exemplar=1&LAN=DE A1 Xin-Ping Qu A1 Mi Zhou A1 Guo-Ping Ru A1 Bing-Zong Li YR 2004 K1 Copper K1 Sputtering K1 Scanning electron microscopy K1 Semiconductor thin films K1 Semiconductor films K1 Ion beams K1 X-ray diffraction K1 X-ray scattering K1 Spectroscopy K1 Amorphous materials SP 520,521,522,523 LK http://dx.doi.org/https://doi.org/10.1109/ICSICT.2004.1435060 DO https://doi.org/10.1109/ICSICT.2004.1435060 SF ELIB - SuUB Bremen
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