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1 Ergebnisse
1
Temperature rise in low-k ULSI interconnects:
, In:
Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.
,
Jia Zhou
;
Gang Ruan
;
Xia Xiao
.. - p. 524,525,526,527 , 2004
Link:
https://doi.org/10.1109/ICSICT.2004.1435061
RT T1
Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.
: T1
Temperature rise in low-k ULSI interconnects
UL https://suche.suub.uni-bremen.de/peid=ieee-1435061&Exemplar=1&LAN=DE A1 Jia Zhou A1 Gang Ruan A1 Xia Xiao A1 Yiping Huang A1 Lee, H.-D. YR 2004 K1 Ultra large scale integration K1 Conductivity K1 Dielectric materials K1 Dielectric constant K1 Dielectric substrates K1 Temperature distribution K1 Heat transfer K1 Nanoporous materials K1 Power system interconnection K1 Heat sinks SP 524,525,526,527 LK http://dx.doi.org/https://doi.org/10.1109/ICSICT.2004.1435061 DO https://doi.org/10.1109/ICSICT.2004.1435061 SF ELIB - SuUB Bremen
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