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A 3-D wafer level hermetical packaging for MEMS:

, In: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.,
Jin, Y.F. ; Wei, J. ; Qi, G.J.... - p. 607,608,609,610 , 2004
Link: https://doi.org/10.1109/ICSICT.2004.1435079