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Reliability analysis in microelectronic packaging by acoust..:
, In:
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005.
,
Wolter, K.-J.
;
Speck, M.
;
Heinze, R.
- p. 436,437,438,439,440,441,442,443 , 2005
Link:
https://doi.org/10.1109/ISSE.2005.1491068
RT T1
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005.
: T1
Reliability analysis in microelectronic packaging by acoustic microscopy
UL https://suche.suub.uni-bremen.de/peid=ieee-1491068&Exemplar=1&LAN=DE A1 Wolter, K.-J. A1 Speck, M. A1 Heinze, R. YR 2005 SN 2161-2528 SN 2161-2064 K1 Microelectronics K1 Microscopy K1 Wafer bonding K1 Nondestructive testing K1 Assembly K1 Plastic packaging K1 Flip chip K1 Heat sinks K1 Multichip modules K1 Copper SP 436,437,438,439,440,441,442,443 LK http://dx.doi.org/https://doi.org/10.1109/ISSE.2005.1491068 DO https://doi.org/10.1109/ISSE.2005.1491068 SF ELIB - SuUB Bremen
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