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1 Ergebnisse
1
The flip-chip mounted mmic technology using the modified mc..:
, In:
IEEE MTT-S International Microwave Symposium Digest, 2005.
,
Sangsub Song
;
Sungwon Kim
;
Sungjin Yeon
... - p. 1011,1012,1013,1014 , 2005
Link:
https://doi.org/10.1109/MWSYM.2005.1516838
RT T1
IEEE MTT-S International Microwave Symposium Digest, 2005.
: T1
The flip-chip mounted mmic technology using the modified mcmd substrate for compact and low-cost w-band transceiver
UL https://suche.suub.uni-bremen.de/peid=ieee-1516838&Exemplar=1&LAN=DE A1 Sangsub Song A1 Sungwon Kim A1 Sungjin Yeon A1 Sangho Park A1 Ju-Yong Lee A1 Sanghyo Lee A1 Wooyeol Choi A1 Youngwoo Kwon A1 Kwang-Seok Seo YR 2005 SN 0149-645X K1 MMICs K1 Transceivers K1 Thermal expansion K1 Thermal conductivity K1 Dielectric substrates K1 Radio frequency K1 Dielectric thin films K1 Coplanar waveguides K1 Silicon K1 Packaging SP 1011,1012,1013,1014 LK http://dx.doi.org/https://doi.org/10.1109/MWSYM.2005.1516838 DO https://doi.org/10.1109/MWSYM.2005.1516838 SF ELIB - SuUB Bremen
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