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1 Ergebnisse
1
Thermo-Mechanical Analysis of the Packaging Process for Mic..:
, In:
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
,
Yek Bing Lee
;
Bailey, C.
;
Hua Lu
... - p. 1-6 , 2006
Link:
https://doi.org/10.1109/ESIME.2006.1644051
RT T1 <cTitle>EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems</cTitle>: T1 <Title>Thermo-Mechanical Analysis of the Packaging Process for Micro-Electronic Displays</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-1644051&Exemplar=1&LAN=DE A1 Yek Bing Lee A1 Bailey, C. A1 Hua Lu A1 Riches, S. A1 Bartholomew, M. A1 Tebbit, N. YR 2006 K1 Thermomechanical processes K1 Packaging K1 Glass K1 Active matrix liquid crystal displays K1 Liquid crystal displays K1 Thermal stresses K1 Capacitive sensors K1 Finite element methods K1 Temperature K1 Aerospace industry SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ESIME.2006.1644051 DO https://doi.org/10.1109/ESIME.2006.1644051 SF ELIB - SuUB Bremen
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