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1
Analysis of silicide process defects by non-contact electro..:
, In:
30th Annual Proceedings Reliability Physics 1992
,
Jenkins, K.A.
;
Agnello, P.D.
;
Bucelot, T.J.
- p. 304,305,306,307,308 , 1992
Link:
https://doi.org/10.1109/RELPHY.1992.187661
RT T1
30th Annual Proceedings Reliability Physics 1992
: T1
Analysis of silicide process defects by non-contact electron-beam charging
UL https://suche.suub.uni-bremen.de/peid=ieee-187661&Exemplar=1&LAN=DE A1 Jenkins, K.A. A1 Agnello, P.D. A1 Bucelot, T.J. YR 1992 K1 Silicides K1 Testing K1 Scanning electron microscopy K1 Electrical resistance measurement K1 Electron beams K1 Leakage current K1 FETs K1 Electrodes K1 Mechanical variables measurement K1 CMOS technology SP 304,305,306,307,308 LK http://dx.doi.org/https://doi.org/10.1109/RELPHY.1992.187661 DO https://doi.org/10.1109/RELPHY.1992.187661 SF ELIB - SuUB Bremen
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