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Reactive ion etching for failure analysis applications:
, In:
30th Annual Proceedings Reliability Physics 1992
,
Abramo, M.T.
;
Roy, E.B.
;
LeCours, S.M.
- p. 315,316,317,318,319 , 1992
Link:
https://doi.org/10.1109/RELPHY.1992.187663
RT T1
30th Annual Proceedings Reliability Physics 1992
: T1
Reactive ion etching for failure analysis applications
UL https://suche.suub.uni-bremen.de/peid=ieee-187663&Exemplar=1&LAN=DE A1 Abramo, M.T. A1 Roy, E.B. A1 LeCours, S.M. YR 1992 K1 Failure analysis K1 Plasma applications K1 Plasma chemistry K1 Wet etching K1 Chemicals K1 Delay K1 Anisotropic magnetoresistance K1 Semiconductor films K1 Plasma materials processing K1 Surface discharges SP 315,316,317,318,319 LK http://dx.doi.org/https://doi.org/10.1109/RELPHY.1992.187663 DO https://doi.org/10.1109/RELPHY.1992.187663 SF ELIB - SuUB Bremen
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