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1 Ergebnisse
1
Identifying the Reliability Affecting Parameters of SBB Fli..:
, In:
2006 1st Electronic Systemintegration Technology Conference
,
Dressler, M.
;
Rohde, H.
;
Liebing, G.
... - p. None , 2006
Link:
https://doi.org/10.1109/ESTC.2006.279976
RT T1
2006 1st Electronic Systemintegration Technology Conference
: T1
Identifying the Reliability Affecting Parameters of SBB Flip Chip Interconnections for Automotive Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-4060700&Exemplar=1&LAN=DE A1 Dressler, M. A1 Rohde, H. A1 Liebing, G. A1 Becker, K.-f. A1 Wunderle, B. A1 Auersperg, J. A1 Reichl, H. YR 2006 K1 Flip chip K1 Automotive applications K1 Temperature sensors K1 Stress K1 Delamination K1 Automotive engineering K1 Humidity K1 Bonding K1 Testing K1 Fatigue SP None LK http://dx.doi.org/https://doi.org/10.1109/ESTC.2006.279976 DO https://doi.org/10.1109/ESTC.2006.279976 SF ELIB - SuUB Bremen
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