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1 Ergebnisse
1
Critical Temperature to Dielectric Degradation of Printed C..:
, In:
2006 IEEE 8th International Conference on Properties & applications of Dielectric Materials
,
Liu, Yong
;
Du, B.x
;
Zhang, Xiangjin
. - p. None , 2006
Link:
https://doi.org/10.1109/ICPADM.2006.284125
RT T1
2006 IEEE 8th International Conference on Properties & applications of Dielectric Materials
: T1
Critical Temperature to Dielectric Degradation of Printed Circuit Board
UL https://suche.suub.uni-bremen.de/peid=ieee-4062614&Exemplar=1&LAN=DE A1 Liu, Yong A1 Du, B.x A1 Zhang, Xiangjin A1 Jiang, Xin YR 2006 SN 2160-9225 SN 2160-9241 K1 Temperature K1 Printed circuits K1 Thermal degradation K1 Copper K1 Surface resistance K1 Thermal resistance K1 Electrodes K1 Dielectric materials K1 Laminates K1 Capacitance SP None LK http://dx.doi.org/https://doi.org/10.1109/ICPADM.2006.284125 DO https://doi.org/10.1109/ICPADM.2006.284125 SF ELIB - SuUB Bremen
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