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1 Ergebnisse
1
On the thermal stability margins of high-leakage current pa..:
, In:
2006 8th Electronics Packaging Technology Conference
,
Lee, Chang-chi
;
de Groot, Johannes
- p. None , 2006
Link:
https://doi.org/10.1109/EPTC.2006.342762
RT T1
2006 8th Electronics Packaging Technology Conference
: T1
On the thermal stability margins of high-leakage current packaged devices
UL https://suche.suub.uni-bremen.de/peid=ieee-4147291&Exemplar=1&LAN=DE A1 Lee, Chang-chi A1 de Groot, Johannes YR 2006 K1 Thermal stability K1 Packaging K1 Temperature K1 Equations K1 Testing K1 Leakage current K1 Finite element methods K1 Power dissipation K1 Silicon K1 Soldering SP None LK http://dx.doi.org/https://doi.org/10.1109/EPTC.2006.342762 DO https://doi.org/10.1109/EPTC.2006.342762 SF ELIB - SuUB Bremen
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