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1 Ergebnisse
1
Si Via Interconnection Technique with Thermal Budget Design:
, In:
2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application
,
Jinwoo, Jeong
;
Eunsung, Lee
;
Hyeon Cheol, Kim
.. - p. None , 2007
Link:
https://doi.org/10.1109/THETA.2007.363432
RT T1
2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application
: T1
Si Via Interconnection Technique with Thermal Budget Design
UL https://suche.suub.uni-bremen.de/peid=ieee-4211110&Exemplar=1&LAN=DE A1 Jinwoo, Jeong A1 Eunsung, Lee A1 Hyeon Cheol, Kim A1 Changyoul, Moon A1 Kukjin, Chun YR 2007 K1 Silicon K1 Packaging K1 Micromechanical devices K1 Temperature K1 Copper K1 Wafer bonding K1 Thermal stresses K1 Stacking K1 Nickel K1 Thermal engineering SP None LK http://dx.doi.org/https://doi.org/10.1109/THETA.2007.363432 DO https://doi.org/10.1109/THETA.2007.363432 SF ELIB - SuUB Bremen
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