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1 Ergebnisse
1
Laser Welding Process and Packaging for Magnetic Field Sens..:
, In:
2006 29th International Spring Seminar on Electronics Technology
,
Nicolics, Johann
;
Musiejovsky, Laszlo
;
Mundlein, Martin
... - p. None , 2006
Link:
https://doi.org/10.1109/ISSE.2006.365151
RT T1
2006 29th International Spring Seminar on Electronics Technology
: T1
Laser Welding Process and Packaging for Magnetic Field Sensors
UL https://suche.suub.uni-bremen.de/peid=ieee-4216081&Exemplar=1&LAN=DE A1 Nicolics, Johann A1 Musiejovsky, Laszlo A1 Mundlein, Martin A1 Zehetner, Hans A1 Steurer, J. A1 Giouroudi, I. A1 Hauser, Hans YR 2006 SN 2161-2528 SN 2161-2064 K1 Magnetic sensors K1 Welding K1 Packaging K1 Wire K1 Manufacturing processes K1 Amorphous materials K1 Thermal loading K1 Production K1 Sensor phenomena and characterization K1 Amorphous magnetic materials K1 GMI-wire K1 transient thermal simulation K1 sapphire substrate SP None LK http://dx.doi.org/https://doi.org/10.1109/ISSE.2006.365151 DO https://doi.org/10.1109/ISSE.2006.365151 SF ELIB - SuUB Bremen
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