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1 Ergebnisse
1
Robust integration of an ULK SiOCH dielectric (k=2.3) for h..:
, In:
2007 IEEE International Interconnect Technology Conferencee
,
Aimadeddine, M.
;
Maury, P.
;
Delaye, V.
... - p. None , 2007
Link:
https://doi.org/10.1109/IITC.2007.382382
RT T1
2007 IEEE International Interconnect Technology Conferencee
: T1
Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL
UL https://suche.suub.uni-bremen.de/peid=ieee-4263694&Exemplar=1&LAN=DE A1 Aimadeddine, M. A1 Maury, P. A1 Delaye, V. A1 Jourdan, N. A1 Vanypre, T. A1 Brun, P. A1 Imbert, G. A1 LeFriec, Y. A1 Mellier, M. A1 Chaabouni, H. A1 Chapelon, L.L. A1 Jousseaume, V. A1 Hamioud, K. A1 Volpi, F. A1 Louis, D. A1 Passemard, G. A1 Torres, J. A1 Arnal, V. A1 Favennec, L. A1 Farcy, A. A1 Zenasni, A. A1 Assous, M. A1 Vilmay, M. A1 Jullian, S. YR 2007 SN 2380-632X SN 2380-6338 K1 Robustness K1 Plasma materials processing K1 Dielectric materials K1 CMOS technology K1 Delay K1 Dielectric constant K1 Plasma chemistry K1 Plasma properties K1 Chemicals K1 Skeleton SP None LK http://dx.doi.org/https://doi.org/10.1109/IITC.2007.382382 DO https://doi.org/10.1109/IITC.2007.382382 SF ELIB - SuUB Bremen
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