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1 Ergebnisse
1
Challenges for 3D IC integration: bonding quality and therm..:
, In:
2007 IEEE International Interconnect Technology Conferencee
,
Leduc, Patrick
;
Sillon, Nicolas
;
Maitrejean, Sylvain
... - p. None , 2007
Link:
https://doi.org/10.1109/IITC.2007.382392
RT T1 <cTitle>2007 IEEE International Interconnect Technology Conferencee</cTitle>: T1 <Title>Challenges for 3D IC integration: bonding quality and thermal management</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-4263704&Exemplar=1&LAN=DE A1 Leduc, Patrick A1 Sillon, Nicolas A1 Maitrejean, Sylvain A1 Louis, Didier A1 Passemard, Gerard A1 de Crecy, Francois A1 Fayolle, Murielle A1 Charlet, Barbara A1 Enot, Thierry A1 Zussy, Marc A1 Jones, Bob A1 Barbe, Jean-Charles A1 Kernevez, Nelly YR 2007 SN 2380-632X SN 2380-6338 K1 Thermal management K1 Three-dimensional integrated circuits K1 Quality management K1 Wafer bonding K1 Temperature K1 Thermal resistance K1 Silicon K1 Stacking K1 Integrated circuit interconnections K1 Dielectric substrates SP None LK http://dx.doi.org/https://doi.org/10.1109/IITC.2007.382392 DO https://doi.org/10.1109/IITC.2007.382392 SF ELIB - SuUB Bremen
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