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Surface Activated Bonding Method for Flexible Lamination:
, In:
Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
,
Howlader, M. M. R.
;
Suga, T.
- p. None , 2007
Link:
https://doi.org/10.1109/POLYTR.2007.4339181
RT T1 <cTitle>Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics</cTitle>: T1 <Title>Surface Activated Bonding Method for Flexible Lamination</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-4339181&Exemplar=1&LAN=DE A1 Howlader, M. M. R. A1 Suga, T. YR 2007 K1 Bonding K1 Lamination K1 Adhesives K1 Laminates K1 Heating K1 Oxidation K1 Plasma temperature K1 Argon K1 Gases K1 Softening SP None LK http://dx.doi.org/https://doi.org/10.1109/POLYTR.2007.4339181 DO https://doi.org/10.1109/POLYTR.2007.4339181 SF ELIB - SuUB Bremen
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