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1 Ergebnisse
1
Impact of Source/Drain Tie on a 30 nm Bottom Gate MOSFETs:
, In:
2007 IEEE Conference on Electron Devices and Solid-State Circuits
,
Lin, Jyi-Tsong
;
Lin, Jeng-Da
;
Shiang-Shi, Kang
... - p. None , 2007
Link:
https://doi.org/10.1109/EDSSC.2007.4450192
RT T1
2007 IEEE Conference on Electron Devices and Solid-State Circuits
: T1
Impact of Source/Drain Tie on a 30 nm Bottom Gate MOSFETs
UL https://suche.suub.uni-bremen.de/peid=ieee-4450192&Exemplar=1&LAN=DE A1 Lin, Jyi-Tsong A1 Lin, Jeng-Da A1 Shiang-Shi, Kang A1 Huang, Hau-Yuan A1 Kao, Kung-Kai A1 Eng, Yi-Chuen YR 2007 K1 MOSFETs K1 Dry etching K1 Immune system K1 Degradation K1 Silicon K1 Numerical simulation K1 Thermal stability K1 Electron beams K1 Lithography K1 Planarization SP None LK http://dx.doi.org/https://doi.org/10.1109/EDSSC.2007.4450192 DO https://doi.org/10.1109/EDSSC.2007.4450192 SF ELIB - SuUB Bremen
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