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1 Ergebnisse
1
Three-Dimensional Mold Flow in Stacked-Chip Scale Packages ..:
, In:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium
,
Abdullah, M.K.
;
Abdullah, M.Z
;
Kamarudin, S.
... - p. None , 2006
Link:
https://doi.org/10.1109/IEMT.2006.4456445
RT T1 <cTitle>2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium</cTitle>: T1 <Title>Three-Dimensional Mold Flow in Stacked-Chip Scale Packages (S-CSP)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-4456445&Exemplar=1&LAN=DE A1 Abdullah, M.K. A1 Abdullah, M.Z A1 Kamarudin, S. A1 Ariff, Z.M. A1 Hussin, P. A1 Antony, J.J. A1 Haroon, H. A1 Saad, M.R. A1 Manikam, M. YR 2006 SN 1089-8190 K1 Navier-Stokes equations K1 Computational modeling K1 Gold K1 Semiconductor device packaging K1 Encapsulation K1 Finite difference methods K1 Chip scale packaging K1 Costs K1 Electromagnetic compatibility K1 Consumer electronics K1 Epoxy Molding Compound (EMC) K1 Kawamura and Kuwahara technique K1 Cross model K1 Finite Difference Method (FDM) SP None LK http://dx.doi.org/https://doi.org/10.1109/IEMT.2006.4456445 DO https://doi.org/10.1109/IEMT.2006.4456445 SF ELIB - SuUB Bremen
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