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1 Ergebnisse
1
Properties of new solder paste system with ultra low residu..:
, In:
2007 9th Electronics Packaging Technology Conference
,
Schmitt, Wolfgang
;
Davies, Jason
;
Ping, Sim Tiow
- p. None , 2007
Link:
https://doi.org/10.1109/EPTC.2007.4469761
RT T1
2007 9th Electronics Packaging Technology Conference
: T1
Properties of new solder paste system with ultra low residue for Die Attach and DCB
UL https://suche.suub.uni-bremen.de/peid=ieee-4469761&Exemplar=1&LAN=DE A1 Schmitt, Wolfgang A1 Davies, Jason A1 Ping, Sim Tiow YR 2007 K1 Microassembly K1 Resins K1 Temperature K1 Viscosity K1 Powders K1 Surface-mount technology K1 Soldering K1 System testing K1 Rheology K1 Stability SP None LK http://dx.doi.org/https://doi.org/10.1109/EPTC.2007.4469761 DO https://doi.org/10.1109/EPTC.2007.4469761 SF ELIB - SuUB Bremen
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