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Reliability studies of AuGe/Ni/Au ohmic contacts to MESFETs..:
, In:
2007 International Workshop on Physics of Semiconductor Devices
,
Sai Saravanan, G.
;
Mahadeva Bhat, K.
;
Vyas, H.P.
... - p. None , 2007
Link:
https://doi.org/10.1109/IWPSD.2007.4472550
RT T1
2007 International Workshop on Physics of Semiconductor Devices
: T1
Reliability studies of AuGe/Ni/Au ohmic contacts to MESFETs by accelerated thermal aging tests
UL https://suche.suub.uni-bremen.de/peid=ieee-4472550&Exemplar=1&LAN=DE A1 Sai Saravanan, G. A1 Mahadeva Bhat, K. A1 Vyas, H.P. A1 Chaturvedi, Sandeep A1 Bhalke, Sangam V. A1 Muralidharan, R. A1 Muraleedharan, K. A1 Pathak, A.P. YR 2007 K1 Ohmic contacts K1 MESFETs K1 Accelerated aging K1 Life estimation K1 Alloying K1 Temperature K1 Life testing K1 Gold alloys K1 Nickel alloys K1 Contact resistance K1 Reliability SP None LK http://dx.doi.org/https://doi.org/10.1109/IWPSD.2007.4472550 DO https://doi.org/10.1109/IWPSD.2007.4472550 SF ELIB - SuUB Bremen
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