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1 Ergebnisse
1
New metallic substrates for high thermal efficient TEC:
, In:
2007 26th International Conference on Thermoelectrics
,
Kim, Bae-Yeon
;
Seo, Won Seon
;
Lee, Myung Hyun
... - p. None , 2007
Link:
https://doi.org/10.1109/ICT.2007.4569490
RT T1 <cTitle>2007 26th International Conference on Thermoelectrics</cTitle>: T1 <Title>New metallic substrates for high thermal efficient TEC</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-4569490&Exemplar=1&LAN=DE A1 Kim, Bae-Yeon A1 Seo, Won Seon A1 Lee, Myung Hyun A1 Choi, Hyoung-Seok A1 Moon, Ji-Woong A1 Lee, Deuk Yong A1 Kim, Kwang Youp YR 2007 SN 1094-2734 K1 Ceramics K1 Thermal conductivity K1 Coatings K1 Plasma density K1 Oxidation K1 Heat sinks K1 Aluminum K1 Tellurium K1 Cooling K1 Acoustic noise SP None LK http://dx.doi.org/https://doi.org/10.1109/ICT.2007.4569490 DO https://doi.org/10.1109/ICT.2007.4569490 SF ELIB - SuUB Bremen
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