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1 Ergebnisse
1
Non-Destructive Quantitative Measurement Method for Normal ..:
, In:
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems
,
Komatsubara, M.
;
Namazu, T.
;
Naka, N.
... - p. None , 2009
Link:
https://doi.org/10.1109/MEMSYS.2009.4805468
RT T1
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems
: T1
Non-Destructive Quantitative Measurement Method for Normal and Shear Stresses on Single-Crystalline Silicon Structures for Reliability of Silicon-MEMS
UL https://suche.suub.uni-bremen.de/peid=ieee-4805468&Exemplar=1&LAN=DE A1 Komatsubara, M. A1 Namazu, T. A1 Naka, N. A1 Kashiwagi, S. A1 Ohtsuki, K. A1 Inoue, S. YR 2009 SN 1084-6999 K1 Stress measurement K1 Silicon K1 Tensile stress K1 Spectroscopy K1 Surface fitting K1 Surface emitting lasers K1 Microstructure K1 Raman scattering K1 Testing K1 Transducers SP None LK http://dx.doi.org/https://doi.org/10.1109/MEMSYS.2009.4805468 DO https://doi.org/10.1109/MEMSYS.2009.4805468 SF ELIB - SuUB Bremen
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