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1 Ergebnisse
1
Demonstration of TFHM scalability to 32 nm node BEOL interc..:
, In:
2009 IEEE International Interconnect Technology Conference
,
Hamioud, K.
;
Arnal, V.
;
Farcy, A.
... - p. None , 2009
Link:
https://doi.org/10.1109/IITC.2009.5090370
RT T1 <cTitle>2009 IEEE International Interconnect Technology Conference</cTitle>: T1 <Title>Demonstration of TFHM scalability to 32 nm node BEOL interconnect and extendibility to ELK k ≤ 2.3 dielectric material</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-5090370&Exemplar=1&LAN=DE A1 Hamioud, K. A1 Arnal, V. A1 Farcy, A. A1 Jousseaume, V. A1 Zenasni, A. A1 Gourhant, O. A1 Icard, B. A1 Pradelles, J. A1 Manakli, S. A1 Brun, Ph. A1 Imbert, G. A1 Jayet, C. A1 Assous, M. A1 Maitrejean, S. A1 Vilmay, M. A1 Galpin, D. A1 Monget, C. A1 Guillan, J. A1 Chhun, S. A1 Richard, E. A1 Barbier, D. A1 Haond, M. YR 2009 SN 2380-632X SN 2380-6338 K1 Scalability K1 Dielectric materials K1 Capacitance K1 CMOS technology K1 Delay K1 Energy consumption K1 Dielectric constant K1 Lithography K1 Electronic mail K1 Metallization SP None LK http://dx.doi.org/https://doi.org/10.1109/IITC.2009.5090370 DO https://doi.org/10.1109/IITC.2009.5090370 SF ELIB - SuUB Bremen
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