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1 Ergebnisse
1
A novel high coplanarity lead free copper pillar bump fabri..:
, In:
2009 IEEE International Interconnect Technology Conference
,
Hsu, Hou-Jun
;
Huang, Jung-Tang
;
Lee, Kuo-Yu
.. - p. None , 2009
Link:
https://doi.org/10.1109/IITC.2009.5090377
RT T1
2009 IEEE International Interconnect Technology Conference
: T1
A novel high coplanarity lead free copper pillar bump fabrication process
UL https://suche.suub.uni-bremen.de/peid=ieee-5090377&Exemplar=1&LAN=DE A1 Hsu, Hou-Jun A1 Huang, Jung-Tang A1 Lee, Kuo-Yu A1 Wu, Rung-Gen A1 Tsai, Ting-Chiang YR 2009 SN 2380-632X SN 2380-6338 K1 Environmentally friendly manufacturing techniques K1 Copper K1 Fabrication K1 Tin K1 Packaging K1 Flowcharts K1 Circuits K1 Semiconductor device measurement K1 Equations K1 Lithography K1 Copper Pillar K1 Lead-Free K1 High Coplanarity SP None LK http://dx.doi.org/https://doi.org/10.1109/IITC.2009.5090377 DO https://doi.org/10.1109/IITC.2009.5090377 SF ELIB - SuUB Bremen
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