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1 Ergebnisse
1
Assembly and reliability of micro-bumped chips with Through..:
, In:
2009 11th Electronics Packaging Technology Conference
,
Ong, Yue Ying
;
Chai, Tai Chong
;
Yu, Daquan
... - p. None , 2009
Link:
https://doi.org/10.1109/EPTC.2009.5416505
RT T1 <cTitle>2009 11th Electronics Packaging Technology Conference</cTitle>: T1 <Title>Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-5416505&Exemplar=1&LAN=DE A1 Ong, Yue Ying A1 Chai, Tai Chong A1 Yu, Daquan A1 Thew, Meei Leng A1 Myo, Eipa A1 Wai, Leong Ching A1 Jong, Ming Chinq A1 Rao, Vempati Srinivasa A1 Su, Nandar A1 Zhang, Xiaowu A1 Damaruganath, Pinjala YR 2009 K1 Through-silicon vias K1 Assembly K1 Silicon K1 Vehicles K1 Aluminum K1 Testing K1 Electronic packaging thermal management K1 Materials reliability K1 Metallization K1 Passivation SP None LK http://dx.doi.org/https://doi.org/10.1109/EPTC.2009.5416505 DO https://doi.org/10.1109/EPTC.2009.5416505 SF ELIB - SuUB Bremen
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