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Case Study of Titanium Nitride defect after Tungsten Etch B..:

, In: 2010 International Conference on Electronic Devices, Systems and Applications,
Ngiaw, Gladys ; Yim, Myung Ho ; You, Hyuk Joon. - p. 340-343 , 2010
Link: https://doi.org/10.1109/ICEDSA.2010.5503047