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Effect of surface finish metallurgy on intermetallic compou..:
, In:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
,
Ourdjini, A.
;
Azmah Hanim, M.A.
;
Aisha, I. Siti Rabiatull
. - p. 1-4 , 2008
Link:
https://doi.org/10.1109/IEMT.2008.5507773
RT T1
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
: T1
Effect of surface finish metallurgy on intermetallic compounds during soldering with tin-silver-copper solders
UL https://suche.suub.uni-bremen.de/peid=ieee-5507773&Exemplar=1&LAN=DE A1 Ourdjini, A. A1 Azmah Hanim, M.A. A1 Aisha, I. Siti Rabiatull A1 Chin, Y.T. YR 2008 SN 1089-8190 SN 1089-8190 K1 Surface finishing K1 Intermetallic K1 Soldering K1 Copper K1 Surface morphology K1 Silver K1 Nickel K1 Gold K1 Grain size K1 Aging SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IEMT.2008.5507773 DO https://doi.org/10.1109/IEMT.2008.5507773 SF ELIB - SuUB Bremen
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