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1 Ergebnisse
1
Packaging of microstrip circuits using bed of springs to su..:
, In:
2010 IEEE MTT-S International Microwave Symposium
,
Rajo-Iglesias, E.
;
Kildal, P-.S.
;
Kishk, A.
- p. 1-1 , 2010
Link:
https://doi.org/10.1109/MWSYM.2010.5517279
RT T1
2010 IEEE MTT-S International Microwave Symposium
: T1
Packaging of microstrip circuits using bed of springs to suppress cavity modes - A replacement for bed of nails
UL https://suche.suub.uni-bremen.de/peid=ieee-5517279&Exemplar=1&LAN=DE A1 Rajo-Iglesias, E. A1 Kildal, P-.S. A1 Kishk, A. YR 2010 SN 0149-645X SN 0149-645X SN 0149-645X K1 Packaging K1 Microstrip K1 Springs K1 Nails K1 Frequency K1 Integrated circuit interconnections K1 Waveguide discontinuities K1 Periodic structures K1 Bandwidth SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/MWSYM.2010.5517279 DO https://doi.org/10.1109/MWSYM.2010.5517279 SF ELIB - SuUB Bremen
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