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1 Ergebnisse
1
Study on thermal model of dynamic temperature calculation o..:
, In:
2010 IEEE International Symposium on Electrical Insulation
,
Lei Ming
;
Liu Gang
;
Lai Yu-ting
... - p. 1-7 , 2010
Link:
https://doi.org/10.1109/ELINSL.2010.5549825
RT T1 <cTitle>2010 IEEE International Symposium on Electrical Insulation</cTitle>: T1 <Title>Study on thermal model of dynamic temperature calculation of single-core cable based on Laplace calculation method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-5549825&Exemplar=1&LAN=DE A1 Lei Ming A1 Liu Gang A1 Lai Yu-ting A1 Li Jin-zhu A1 Li Wenxiang A1 Liu Yi-gang YR 2010 SN 1089-084X SN 1089-084X K1 Temperature K1 Circuits K1 Infrared heating K1 Heat transfer K1 Communication cables K1 Thermal conductivity K1 Mathematical model K1 Conductors K1 Finite element methods K1 Monitoring K1 real-time calculation K1 cable core temperature K1 dynamic response K1 thermal circuit model K1 finite element model K1 Laplace thermal circuit mode SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ELINSL.2010.5549825 DO https://doi.org/10.1109/ELINSL.2010.5549825 SF ELIB - SuUB Bremen
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