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1 Ergebnisse
1
Effects of BN and SiC nanoparticles on properties of conduc..:
, In:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
,
Huaxiang Lai
;
Xiuzhen Lu
;
Huiwang Cui
... - p. 235-239 , 2010
Link:
https://doi.org/10.1109/ICEPT.2010.5582434
RT T1
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
: T1
Effects of BN and SiC nanoparticles on properties of conductive adhesive
UL https://suche.suub.uni-bremen.de/peid=ieee-5582434&Exemplar=1&LAN=DE A1 Huaxiang Lai A1 Xiuzhen Lu A1 Huiwang Cui A1 Xiaohua Liu A1 Si Chen A1 Tianan Chen A1 Liu, Johan YR 2010 K1 Resistance K1 Conductive adhesives K1 Humidity K1 Aging K1 Nanoparticles K1 Silver K1 Reliability SP 235 OP 239 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2010.5582434 DO https://doi.org/10.1109/ICEPT.2010.5582434 SF ELIB - SuUB Bremen
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