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1 Ergebnisse
1
Interfacial reaction and melting/solidification characteris..:
, In:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
,
Zhou, Min-Bo
;
Qin, Hong-Bo
;
Ma, Xiao
. - p. 202-207 , 2010
Link:
https://doi.org/10.1109/ICEPT.2010.5582442
RT T1 <cTitle>2010 11th International Conference on Electronic Packaging Technology & High Density Packaging</cTitle>: T1 <Title>Interfacial reaction and melting/solidification characteristics between Sn and different metallizations of Cu, Ag, Ni and Co</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-5582442&Exemplar=1&LAN=DE A1 Zhou, Min-Bo A1 Qin, Hong-Bo A1 Ma, Xiao A1 Zhang, Xin-Ping YR 2010 K1 Tin K1 Copper K1 Metallization K1 Nickel K1 Soldering K1 Heating SP 202 OP 207 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2010.5582442 DO https://doi.org/10.1109/ICEPT.2010.5582442 SF ELIB - SuUB Bremen
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