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Experimental research on Sn99.0/Ag0.3/Cu0.7 lead-free solde..:

, In: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,
Yong Ping, Lei ; Jian, Lin ; Han Guang, Fu... - p. 935-937 , 2010
Link: https://doi.org/10.1109/ICEPT.2010.5582650