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1 Ergebnisse
1
The influence of standoff height and pad size on the Shear ..:
, In:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
,
Li, Xun-Ping
;
Xia, Jian-Min
;
Zhou, Min-Bo
.. - p. 1118-1123 , 2010
Link:
https://doi.org/10.1109/ICEPT.2010.5582738
RT T1 <cTitle>2010 11th International Conference on Electronic Packaging Technology & High Density Packaging</cTitle>: T1 <Title>The influence of standoff height and pad size on the Shear fracture behavior of BGA structured Cu/Sn3.0Ag0.5Cu/Cu interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-5582738&Exemplar=1&LAN=DE A1 Li, Xun-Ping A1 Xia, Jian-Min A1 Zhou, Min-Bo A1 Ma, Xiao A1 Zhang, Xin-Ping YR 2010 K1 Soldering K1 Joints K1 Aging K1 Copper K1 Isothermal processes K1 Microstructure K1 Morphology SP 1118 OP 1123 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2010.5582738 DO https://doi.org/10.1109/ICEPT.2010.5582738 SF ELIB - SuUB Bremen
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