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1 Ergebnisse
1
An investigation of temperature effects with on-chip passiv..:
, In:
ASIC, 2003. Proceedings. 5th International Conference on
,
Jinglin Shi, Jinglin Shi
;
Huailin Liao, Huailin Liao
;
Yong Zhong Xiong, Yong Zhong Xiong
. - p. None , 2003
Link:
https://doi.org/10.1109/ICASIC.2003.1277403
RT T1
ASIC, 2003. Proceedings. 5th International Conference on
: T1
An investigation of temperature effects with on-chip passive components
UL https://suche.suub.uni-bremen.de/peid=ieee-5733591&Exemplar=1&LAN=DE A1 Jinglin Shi, Jinglin Shi A1 Huailin Liao, Huailin Liao A1 Yong Zhong Xiong, Yong Zhong Xiong A1 Rustagi, S.C. YR 2003 SN 1523-553X K1 MIM structures K1 Q-factor K1 inductors K1 integrated circuit interconnections K1 integrated circuit testing K1 temperature distribution K1 25 to 85 degC K1 MIM K1 inductor model K1 interconnect K1 metal layer temperature effect K1 metal-insulator-metal capacitor K1 on-chip passive components K1 on-chip planar spiral inductor K1 quality factor K1 substrate temperature effect K1 temperature coefficients K1 temperature effects SP None LK http://dx.doi.org/https://doi.org/10.1109/ICASIC.2003.1277403 DO https://doi.org/10.1109/ICASIC.2003.1277403 SF ELIB - SuUB Bremen
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