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Copper Oxide Films Formed By Reactive Cathodic Arc Depositi..:
, In:
Proceedings of 1994 IEEE 21st International Conference on Plasma Sciences (ICOPS)
,
Anders, S.
;
Anders, A.
;
Brown, I.G.
... - p. 165 , 1994
Link:
https://doi.org/10.1109/PLASMA.1994.588983
RT T1
Proceedings of 1994 IEEE 21st International Conference on Plasma Sciences (ICOPS)
: T1
Copper Oxide Films Formed By Reactive Cathodic Arc Deposition
UL https://suche.suub.uni-bremen.de/peid=ieee-588983&Exemplar=1&LAN=DE A1 Anders, S. A1 Anders, A. A1 Brown, I.G. A1 MacGill, R.A. A1 Dickinson, M.R. A1 Castro, R.A. YR 1994 SN 0730-9244 K1 Copper K1 Substrates K1 Plasma sources K1 Radio frequency K1 Plasma materials processing K1 Laboratories K1 Cathodes K1 Plasma immersion ion implantation K1 Plasma properties K1 Coatings SP 165 LK http://dx.doi.org/https://doi.org/10.1109/PLASMA.1994.588983 DO https://doi.org/10.1109/PLASMA.1994.588983 SF ELIB - SuUB Bremen
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