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1 Ergebnisse
1
Coupled electrical and thermal 3D IC centric microfluidic h..:
, In:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
,
Zhang, Yue
;
King, Calvin R.
;
Zaveri, Jesal
... - p. 2037-2044 , 2011
Link:
https://doi.org/10.1109/ECTC.2011.5898797
RT T1
2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
: T1
Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology
UL https://suche.suub.uni-bremen.de/peid=ieee-5898797&Exemplar=1&LAN=DE A1 Zhang, Yue A1 King, Calvin R. A1 Zaveri, Jesal A1 Kim, Yoon Jo A1 Sahu, Vivek A1 Joshi, Yogenda A1 Bakir, Muhannad S. YR 2011 SN 2377-5726 SN 0569-5503 SN 0569-5503 K1 Heat sinks K1 Through-silicon vias K1 Resistance heating K1 Three dimensional displays K1 Thermal resistance K1 3D IC K1 microchannel heat sink K1 micropin-fin heat sink K1 through-silicon via (TSV) K1 Electrical model of TSV SP 2037 OP 2044 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2011.5898797 DO https://doi.org/10.1109/ECTC.2011.5898797 SF ELIB - SuUB Bremen
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