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1 Ergebnisse
1
Decoupling capacitance for the power integrity of 3D-DRAM-o..:
, In:
2011 IEEE 13th Electronics Packaging Technology Conference
,
Ahmad, Waqar
;
Qiang Chen
;
Li-Rong Zheng
. - p. 590-594 , 2011
Link:
https://doi.org/10.1109/EPTC.2011.6184489
RT T1
2011 IEEE 13th Electronics Packaging Technology Conference
: T1
Decoupling capacitance for the power integrity of 3D-DRAM-over-logic system
UL https://suche.suub.uni-bremen.de/peid=ieee-6184489&Exemplar=1&LAN=DE A1 Ahmad, Waqar A1 Qiang Chen A1 Li-Rong Zheng A1 Tenhunen, Hannu YR 2011 K1 Random access memory K1 Capacitance K1 Through-silicon vias K1 Power distribution K1 Mathematical model K1 Three dimensional displays K1 Capacitors K1 Decoupling capacitance K1 3D-DRAM K1 Power integrity SP 590 OP 594 LK http://dx.doi.org/https://doi.org/10.1109/EPTC.2011.6184489 DO https://doi.org/10.1109/EPTC.2011.6184489 SF ELIB - SuUB Bremen
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