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Three dimensional metallization for vertically integrated c..:

, In: European Workshop Materials for Advanced Metallization,,

Bollmann, D. ; Braun, R. ; Buchner, R.... - p. 94,95,96,97,98 , 1997

Link: https://doi.org/10.1109/MAM.1997.621072

RT 
T1 <cTitle>European Workshop Materials for Advanced Metallization,</cTitle>: T1 <Title>Three dimensional metallization for vertically integrated circuits</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-621072&Exemplar=1&LAN=DE
				
A1 Bollmann, D.
A1 Braun, R.
A1 Buchner, R.
A1 Cao-Minh, U.
A1 Engelhardt, M.
A1 Errmann, G.
A1 Grassl, T.
A1 Hieber, K.
A1 Hubner, H.
A1 Kawala, G.
A1 Kleiner, M.
A1 Klumpp, A.
A1 Kuhn, S.
A1 Landesberger, C.
A1 Lezec, H.
A1 Muth, W.
A1 Pamler, W.
A1 Popp, R.
A1 Renner, E.
A1 Ruhl, G.
A1 Sanger, A.
A1 Scheler, U.
A1 Schmidt, C.
A1 Schwarzl, S.
A1 Weber, J.
A1 Weber, W.
A1 Ramm, P.
YR 1997
SN 1266-0167
K1 Integrated circuit metallization
K1 Integrated circuit technology
K1 Wiring
K1 Microelectronics
K1 Fabrication
K1 Circuit testing
K1 Integrated circuit reliability
K1 Inorganic materials
K1 Copper
K1 Three-dimensional integrated circuits
SP 94,95,96,97,98
LK http://dx.doi.org/https://doi.org/10.1109/MAM.1997.621072
DO https://doi.org/10.1109/MAM.1997.621072
SF ELIB - SuUB Bremen

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