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Reliability of circuits under pads for Au and Cu wire bondi..:

, In: 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits,
Gambino, J. P. ; Malinowski, J. ; Cote, A.... - p. 1-6 , 2012
Link: https://doi.org/10.1109/IPFA.2012.6306251