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Through-silicon-via built-in self-repair for aggressive 3D ..:

, In: 2012 IEEE 18th International On-Line Testing Symposium (IOLTS),
Nicolaidis, Michael ; Pasca, Vladimir ; Anghel, Lorena - p. 91-96 , 2012
Link: https://doi.org/10.1109/IOLTS.2012.6313847