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Influence of via stubs with different terminations on time-..:

, In: 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS),
Yeh, Chi-Lou ; Tsai, Yi-Chin ; Hsu, Che-Ming... - p. 149-152 , 2012
Link: https://doi.org/10.1109/EDAPS.2012.6469414