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1 Ergebnisse
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Influence of via stubs with different terminations on time-..:
, In:
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
,
Yeh, Chi-Lou
;
Tsai, Yi-Chin
;
Hsu, Che-Ming
... - p. 149-152 , 2012
Link:
https://doi.org/10.1109/EDAPS.2012.6469414
RT T1
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
: T1
Influence of via stubs with different terminations on time-domain transmission waveform and eye diagram in multilayer PCBs
UL https://suche.suub.uni-bremen.de/peid=ieee-6469414&Exemplar=1&LAN=DE A1 Yeh, Chi-Lou A1 Tsai, Yi-Chin A1 Hsu, Che-Ming A1 Liu, Li-Sang A1 Tsai, Sheng- Hsun A1 Kao, Yu Han A1 Shiue, Guang-Hwa YR 2012 SN 2151-1225 SN 2151-1233 K1 Time domain analysis K1 Integrated circuits K1 Silicon K1 plated though-hole (PTH) vias K1 open stubs K1 signal integrity K1 termination K1 lattice diagram K1 time-domain transmission (TDT) SP 149 OP 152 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS.2012.6469414 DO https://doi.org/10.1109/EDAPS.2012.6469414 SF ELIB - SuUB Bremen
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