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Study on interfacial behavior and shear strength of lead-fr..:

, In: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging,
Zhou, Bin ; Zhou, Qing ; En, Yun-fei - p. 1317-1319 , 2012
Link: https://doi.org/10.1109/ICEPT-HDP.2012.6474848