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mmW characterization of wafer level passivation for 3D sili..:

, In: 2013 IEEE 63rd Electronic Components and Technology Conference,
Lamy, Y. ; El Bouayadi, O. ; Ferrandon, C.... - p. 1887-1891 , 2013
Link: https://doi.org/10.1109/ECTC.2013.6575835