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Failure analysis on non-visible front-end defects in deep N..:
, In:
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Boon, Ang Ghim
;
Chen, Changqing
;
Zhao, Si Ping
... - p. 177-181 , 2013
Link:
https://doi.org/10.1109/IPFA.2013.6599149
RT T1
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Failure analysis on non-visible front-end defects in deep NWELL implantation related process
UL https://suche.suub.uni-bremen.de/peid=ieee-6599149&Exemplar=1&LAN=DE A1 Boon, Ang Ghim A1 Chen, Changqing A1 Zhao, Si Ping A1 Neo, Soh Ping A1 Yip, Kim Hong A1 Loh, Sock Khim A1 Ng, Hui Peng A1 Teo, Angela A1 Ng, Peng Tiong YR 2013 SN 1946-1550 SN 1946-1542 K1 Failure analysis K1 Integrated circuits K1 Plugs K1 Instruction sets K1 Decision support systems K1 Stress K1 Surface treatment SP 177 OP 181 LK http://dx.doi.org/https://doi.org/10.1109/IPFA.2013.6599149 DO https://doi.org/10.1109/IPFA.2013.6599149 SF ELIB - SuUB Bremen
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