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Modeling methodologies for multi level PCB-package co-simul..:

, In: 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems,
Scogna, Antonio Ciccomancini ; Chiang, ChunTong ; Lau, Linus.. - p. 57-57 , 2013
Link: https://doi.org/10.1109/EPEPS.2013.6703466