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Detecting buried voids in copper interconnect:

, In: 2013 e-Manufacturing & Design Collaboration Symposium (eMDC),
Liao, Hsiang-Chou ; SiYeul Yoon ; Moreau, Olivier... - p. 1-4 , 2013
Link: https://doi.org/10.1109/eMDC.2013.6756067