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Process development to enable 3D IC multi-tier die bond for..:

, In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC),
Hu, Y. H. ; Liu, C. S. ; Chen, M. T.... - p. 572-575 , 2014
Link: https://doi.org/10.1109/ECTC.2014.6897342