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1 Ergebnisse
1
Wet silicon etch process for TSV reveal:
, In:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
,
Mauer, Laura B.
;
Taddei, John
;
Youssef, Ramey
... - p. 878-882 , 2014
Link:
https://doi.org/10.1109/ECTC.2014.6897390
RT T1
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
: T1
Wet silicon etch process for TSV reveal
UL https://suche.suub.uni-bremen.de/peid=ieee-6897390&Exemplar=1&LAN=DE A1 Mauer, Laura B. A1 Taddei, John A1 Youssef, Ramey A1 Lu, Yongqiang A1 Collins, Sian A1 McLaughlin, Kevin A1 Allen, Craig YR 2014 SN 0569-5503 SN 2377-5726 K1 Through-silicon vias K1 Silicon K1 Surface treatment K1 Rough surfaces K1 Surface roughness K1 Chemicals SP 878 OP 882 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2014.6897390 DO https://doi.org/10.1109/ECTC.2014.6897390 SF ELIB - SuUB Bremen
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